Method 5005: Table IIb: Group B tests for class level B |
| Test |
note |
MIL-STD
-883
method |
Condition |
Quantity/accept
or sample
size/accept |
Subgroup
Resistant to solvents |
(3) |
2015 |
|
3/0 |
Subgroup 2
Solderability |
(4) |
2003 |
soldering temp
245°C ± 5°C |
sample size
number = 22, c = 0 |
Subgroup 3
Bond strength
1) Thermo-compression
2) Ultrasonic / Wedge
3) Flip-chip
4) Beam lead |
(5) |
2011 |
1) Test Condition C or D
2) Test Condition C or D
3) Test Condition F
4) Test Condition H
|
sample size
number = 15, c = 0 |
3) Resistance to solvents testing required only on devices using inks or paints as the marking or contrast.
4) Devices submitted for solderability shall be in the same lead finish as shipped product and must have been through the temp/time exposure of burn in except
for devices which have been hot solder dipped or have tin-lead fusing after burn-in.
5) Unless otherwise specified the sample size number for condition
C or D is the number of bond pulls selected from a minimum number of 4 devices and for condition F or H is the number of dice (not bonds) |
Method 5005: Table IV Group D (package related
tests) for class level B |
| Test |
MIL-STD-883
method |
Condition |
Quantity/accept or
sample size/accept |
| Subgroup 1 (2) |
|
|
|
Physical Dimensions |
2016 |
|
sample size
number = 15, c = 0 |
| Subgroup 2 |
|
|
|
a) Lead Integrity (3)
b) Seal - Fine & Gross leak (4) |
2004
1014 |
Test Condition B (lead fatigue)
As applicable |
sample size
number = 45, c = 0 |
Subgroup 3 (5) |
|
|
|
a) Thermal Shock
b) Temp Cycle
c) Moisture resistance
|
1011
1010
1004 |
Test cond B as a min.
15 cycles min
Test Condition C.
100 cycles min |
sample size
number = 15, c = 0 |
| d) Visual Examination |
|
In accordance with visual criteria method 1004 and 1010 |
|
e) Seal - Fine & Gross leak
f) End Point Electricals |
1010 |
as applicable
As specified in the applicable
device specification |
|
| Subgroup 4 (5) |
|
|
|
a) Mechanical Shock
b) Vibration, variable frequency
c) Constant Acceleration
d) Seal - Fine & Gross leak
e)
Visual examination
f) End point Electricals |
2002
2007
2001
1014 |
Test condition B minimum
Test condition A minimum
Test condition E minimum
(Y1 only)
In accordance with method
1010 or 1101
As specified in applicable
device specification |
sample size
number = 15, c = 0 |
| Subgroup 5 (2) |
|
|
|
a) Salt Atmosphere
b) Visual Examination
c) Seal - Fine & Gross leak |
1009
1014 |
Test condition A minimum
In accordance with
method 1009 |
sample size
number = 15, c = 0 |
| Subgroup 6 (2) |
|
|
|
a) Internal water-vapour
content |
1018 |
5000ppm max water content
at 100°C |
3/0 or 5/1 |
| Subgroup 7 (2) |
|
|
|
a) Adhesion of Lead
finish (12) |
2025 |
|
sample size
number = 15, c = 0 |
| Subgroup 8 (2) |
|
|
|
| a) Lid Torque |
2024 |
|
5/0 |
1) In line monitor data may be substituted for subgroups D1,D2,D6,D7 and D8 upon approval by the qualifying activity.
The monitors shall be performed by package type and to the specified subgroup test method.
2) Electrical reject devices from the same inspection lot may be used for samples.
3) The sample size number of 45, C=0 for lead integrity shall be based on the number of leads or terminals tested and shall be taken from a minimum of
3 devices.
4) Seal tests need only be performed on packages having leads exiting through a glass seal.
5) Devices used in subgroup 3 can be used in subgroup 4.
8) End point electrical parameters may be performed after moisture resistance and prior to seal test.
12) Sample size based on number of leads.
