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THE DIVISIONS
POWER
AEROSPACE
OPTO
RF
MAGNATEC
ESA Chart III Burn-In and Electrical
Components from Final Production Test
Testing Levels
B
C
Para 9.95
Verification of Safe Operating Area
Y
Y
Para 9.9.1
Parameter Drift Value
(Initial Measurement for HTRB)
Y
-
Para 7.71 (a)
Para 9.22
High Temperature Reverse Bias Burn-in
Y
Y
Para 9.9.1
Parameter Drift Value
(Final Measurement for HTRB,
Initial Measurement for Burn-In)
Y
-
Para 9.9.2
Burn-in 168 Hours
Y
Y
Para 9.9.1
Parameter Drift Value
(Final Measurement for Burn-In)
Y
-
Para 9.9.2
Electrical Measurements - High & Low temp
Y
Y
Para 9.9.3
Electrical Measurements - Room temp (3)
Y
Y
Para 9.12
Radiographic Inspection (1) (2)
Y
-
Para 9.9.8.1/2
Seal Test (Fine & Gross Leak)
Y
Y
Para 9.10
External Visual Inspection
Y
Y
Para 7.4
Check for Lot failure
Y
Y
To Chart IV
To Chart V
Radiographic inspection may be performed at any point during the test sequence shown in this chart.
Radiographic inspection rejects not to be counted for lot failure.
Measurement of parameters for the purpose of drift value measurements need not be repeated for electrical measurements at room temperature.
1
PRODUCT LINES
Pack Ranges & Benefits
Surface Mount/LCCs
Modern Metal Hermetic
Traditional Metal Packs
Multi-Chips Arrays
Modules
Custom Packages Preform Options
2
TECHNOLOGIES
Bipolar Transistors
FETs, JFETs, IGBTs
Diodes
Linears / PWMs
Mixed Technologies
Advanced Technologies
3
SCREENING &
QUALIFICATIONS
Semelab Hi-Rel Processing
Extensive Defence Qualifications
Many Screening Flows
ESA Space Level
Customer Specifications
BS Processing
CECC Processing
DSCC/883B Processing
MIL-PRF-19500
product flows
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